Hyderabad, July 19: Union Minister for Electronics and Information Technology Ashwini Vaishnaw announced that India’s first domestically manufactured semiconductor chip will be ready for rollout in 2025, marking a historic milestone in the country’s push for self-reliance in critical technology.
Speaking at the 85th Foundation Day celebration of the Keshav Memorial Educational Society in Hyderabad, Vaishnaw revealed that construction is underway for six government-approved semiconductor fabrication plants. These developments are part of India’s larger ambition to become a global hub for electronics and chip manufacturing.
“Some of the world’s most complex semiconductor chips are already being designed in cities like Hyderabad, Bengaluru, Pune, Gurugram, and Chennai. Now we are taking the next leap into manufacturing. The first ‘Made in India’ chip will be ready next year,” the Minister said.
He also highlighted ongoing initiatives under the India AI Mission, including the release of free datasets to fuel innovation and the training of one million individuals in artificial intelligence technologies.
Vaishnaw projected that India is on track to become one of the world’s top two economies by 2047, citing a shift in global power from the West to the Eastern hemisphere, with India poised to play a leading role.
At the 14th Convocation of IIT Hyderabad, held a day later, the Minister emphasized India’s electronics sector growth, stating that electronics exports have surpassed USD 40 billion—an eightfold increase over the past 11 years. He added that domestic electronics production has grown six times during the same period.
He also gave an update on India’s first bullet train project, confirming that it is progressing steadily and is expected to begin operations by August or September 2027.
The announcement of the upcoming semiconductor chip rollout signals a transformative phase for India’s tech and manufacturing landscape, further bolstering its vision of technological sovereignty and economic leadership.
