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India and Singapore Forge Stronger Ties with Four New Agreements

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During Prime Minister Narendra Modi’s visit to Singapore on Thursday, India and Singapore signed four important Memorandums of Understanding (MoUs) aimed at deepening their bilateral cooperation. The agreements, which were formalized at Singapore’s Parliament House, address areas including digital technology, semiconductors, health and medicine, and education and skills development.

The MoUs were signed by India’s External Affairs Minister S. Jaishankar and Singapore’s Foreign Minister Vivian Balakrishnan, with Prime Ministers Modi and Lawrence Wong present.

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The first MoU focuses on digital technology cooperation between India’s Ministry of Electronics and Information Technology and Singapore’s Ministry of Digital Development and Information. This agreement covers digital infrastructure, cyber-security, 5G, supercomputing, quantum computing, artificial intelligence, and worker upskilling in the digital sector.

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The second MoU aims to strengthen the semiconductor sector collaboration between the two countries, facilitating semiconductor cluster development and talent growth. Singaporean companies, which are crucial in the global semiconductor supply chain, are expected to invest in India through this agreement.

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The third MoU, signed by the health ministries of both nations, focuses on advancing joint research, innovation, and human resource development in healthcare and pharmaceuticals.

The final MoU, between India’s Ministry of Skill Development and Entrepreneurship and Singapore’s Ministry of Education, aims to boost cooperation in technical and vocational education, supporting ongoing skill development efforts.

Additionally, Prime Minister Modi and Prime Minister Wong toured the semiconductor facility of AEM Holdings Ltd in Singapore, highlighting the potential for trade and investment in the semiconductor sector, where India’s resources and skilled labor can complement Singapore’s advanced industry.

The agreements and visit emphasize the potential for expanded cooperation and investment between the two countries, particularly in the semiconductor industry, which includes design, assembly, wafer fabrication, and equipment manufacturing.

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